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LSI Joins the Open Compute Project

LSI Joins the Open Compute Project

LSI Joins the Open Compute Project

LSI Corporation has announced its membership in the Open Compute Project (OCP) and is in the process of contributing two storage infrastructure  reference designs to the OCP global community. LSI Chief Technology Officer Greg Huff will be a featured speaker at the OCP Summit taking place January 28-29 in San Jose, Calif. Huff’s presentation, titled “The Datacentered Future,” will focus on the future vision for the datacenter and the valuable role of the OCP and vendor contributions. LSI will also showcase Open Compute technology demonstrations at its booth.

“Open Compute is about the ability to scale computing infrastructure in the most efficient and economical way possible to achieve more work per dollar,” Huff says. “LSI storage solutions play an important role in the datacenter, and our technology can be found in every current contribution to the Open Compute Project. We’re excited to formally join the OCP and look forward to continued contributions to the community.”

LSI is contributing two storage infrastructure reference designs to the OCP. The first is a board design for a 12Gb/s SAS Open Vault storage enclosure. The Open Vault is a cost-effective storage solution with a modular I/O topology that’s built for the Open Rack. The storage solution is designed to enable Open Vault to optimize the performance of 12Gb/s SAS infrastructure by utilizing LSI’s unique DataBoltbandwidth optimizer technology. DataBolt technology aggregates the performance of storage devices to enable 30-60 percent higher bandwidth from existing SATA drives in the Open Vault enclosure.

LSI is also contributing a design from its Nytro XP6200 series of PCIe flash accelerator cards, which are purpose-built to meet the requirements of Open Compute and other hyperscale servers. The Nytro XP6209 card is a 1TB flash card designed to provide hyperscale cloud datacenters with accelerated performance for read-intensive applications, optimized power and thermals, and an overall lower-cost-per-gigabyte PCIe flash solution for server-based applications.

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About Kalpana Singhal

Kalpana Singhal is Co-Founder & Editor in Chief at Techplus Media. She is an Innovative & challenger Entrepreneur who started her journey from corporate communication in early 2001 with I.T. Industry followed by Lead - Editorial at BeautyIndia.in in 2008 . You can follow her on twitter, Google+ and Facebook.

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